PolyTC®: Technical Specifications
Features | Typical Value |
| Functionality | Multi-touch, touch & gesture, individual keys, sliders, jog dials, proximity switch, 3D gestures |
| Transparency | > 85% (depending on layout) |
| Surface resistance | 15 – 30 Ω/qs |
| Structure size | Min. 6 μm |
| Sensor size | From individual keys to ~12” (depending on image format) |
| Conductive material | Silver (Ag) |
| Contact stiffening | Carbon black |
| Contact options | Integrated tail for ZIF connectors, direct contact for ACF bonding, others possible |
| Substrate | Polyester (PET), transparent |
| Standard substrate thickness | 50; 75 μm |
| Set-up | See layer stack below, total thickness without adhesive layer ~100 μm |
| Optical characteristics | Suitable sensor layout, e.g., moiré-free, no color change |
| Layout design | Custom, e.g., backgammon, diamond pattern, individual keys |
| Selection process | Self-cap, mutual-cap |
| Input lead | Directly integrated for Chip on Board (CoB) or without tail for Chip on Flex (CoF) |
| Resistance | Customer-specific, e.g., moisture, temperature fluctuations during storage |
| Delivery form | Individual labels, other forms of delivery on request |